Electrolytic method for filling holes and cavities with metals
AssigneeAtotech Deutschland GmbH
InventorsBert Reents, Bernd Roelfs, Tafadzwa Magaya, Markus Youkhanis, René Wenzel, Soungsoo Kim
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AssigneeAtotech Deutschland GmbH
InventorsBert Reents, Bernd Roelfs, Tafadzwa Magaya, Markus Youkhanis, René Wenzel, Soungsoo Kim
Estimating the term…
Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.
A galvanic method for filling cavities, blind holes or micro blind holes of a work piece with metals, comprising
A galvanic method for filling cavities, through holes, blind holes or micro blind holes of a work piece with metals, comprising
Dependencies are inferred from the claim text.