System and method for dual-sided sputter etch of substrates

An etch chamber for etching disks, comprising:

• a chamber body having a transport section for carrier transport and processing section, and having tracks in the transport section;
• a disk carrier riding on the tracks so as to position the disk in the processing section, wherein the disk is held by its periphery by clips and is held vertically such that both sides of the disk can be processed;
• a precursor gas delivery assembly coupled to the chamber body;
• a movable electrode assembly coupled on one side of the chamber body and having a conductive electrode and an electrode cover;
• wherein the movable electrode is constructed to selectively have the conductive electrode assume a position proximal to backside surface of the disk without touching any surface of the disk for processing, and a position distal to the disk for disk transport;
• wherein the electrode cover covers the edges of the disk and thereby prevents plasma from reaching the backside surface of the disk, and the electrode cover has notches that match the clips so that when the conductive electrode is in its proximal position the cover does not touch the clips;
• and,
• RF source coupled to the electrode to thereby capacitively couple RF energy to the backside surface of the disk and cause plasma species to accelerate towards the disk so as to etch the surface opposite the backside surface of the disk.