Working electrode design for electrochemical processing of electronic components

An electrode system of an electroplating apparatus, the electrode system comprising:

• a working electrode comprising a supported portion and an exposed portion, wherein the exposed portion defines a plating surface;
• a thief electrode that is separated from the working electrode, wherein an exterior face of the thief electrode is offset from the plating surface of the working electrode;
• and
• a holder configured to support the working electrode, the holder comprising a lip portion comprising:
• a first surface extending over and directly contacting the supported portion of the working electrode, and
• a second surface opposing the first surface and directly contacting the thief electrode,
• wherein the thief electrode comprises a rim portion extending beyond an edge of the lip portion of the holder and overlapping the plating surface of the working electrode about a perimeter of the working electrode, and
• wherein the working electrode and the thief electrode are configured to be in electrical communication with at least one power supply.