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US 8,784,572 B2Granted
Method for cleaning platinum residues on a semiconductor substrate
AssigneeIntermolecular, Inc.
InventorsAnh Duong, Sean Barstow, Olov Karlsson, Bei Li, James Mavrinac
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Abstract
A method for cleaning platinum residues from a surface of a substrate is provided. The method initiates with exposing the surface to a first solution containing a mixture of nitric acid and hydrochloric acid. Then, the surface is exposed to a second solution containing hydrochloric acid.
Claims11
A method for cleaning platinum residues from a surface of a semiconductor substrate, comprising:
- exposing the surface of the semiconductor substrate to a first solution containing a mixture of nitric acid and hydrochloric acid;
- saturating a second solution with chlorine gas prior to applying the second solution to the surface of the semiconductor substrate;
- and
- after exposing the surface of the semiconductor substrate to the first solution, exposing the surface of the semiconductor substrate to the second solution containing hydrochloric acid wherein the first solution and the second solution are different.
1 more element
A method for cleaning platinum residues from a surface of a semiconductor substrate, comprising:
- exposing the surface the semiconductor substrate of to a first solution containing a mixture of nitric acid and hydrochloric acid at a molar ratio of approximately 1:3 to 1:12;
- rinsing the surface of the semiconductor substrate with deionized water;
- saturating a second solution with chlorine gas prior to applying the second solution to the surface of the semiconductor substrate;
- and
- exposing the surface of the semiconductor substrate to a second solution containing hydrochloric acid at a concentration of approximately 10% to 20% by volume wherein the first solution and the second solution are different.
2 more elements
Dependencies are inferred from the claim text.