LED packaging structure having improved thermal dissipation and mechanical strength

A photonic lighting module, comprising:

• a heat sink;
• a substrate disposed over the heat sink and thermally coupled to the heat sink;
• a printed circuit board substrate disposed over the heat sink, the printed circuit board substrate surrounding the substrate;
• a plurality of metal pads disposed at least partially over the substrate and over the printed circuit board substrate, wherein at least one of the metal pads is disposed partially over both the substrate and the printed circuit board substrate;
• and
• one or more light-emitting devices disposed on a subset of the metal pads;
• wherein:
• the one or more light-emitting devices are thermally coupled to the heat sink through the substrate;
• the one or more light-emitting devices are electrically coupled to the printed circuit board substrate through the metal pads;
• and
• the at least one of the metal pads is disposed directly above a first one and a second one of the metal pads, the first one of the metal pads being disposed over the substrate, and the second one of the metal pads being disposed over the printed circuit board substrate.

A packaging structure for a light-emitting device, comprising:

• a printed circuit board structure having an opening extending therethrough;
• a substrate positioned within the opening of the printed circuit board structure;
• a heat sink on which the printed circuit board structure and the substrate are located;
• a first metal pad located over the substrate, wherein the light-emitting device is thermally coupled to the first metal pad;
• a second metal pad located over the printed circuit board structure, wherein the second metal pad is electrically coupled to the light-emitting device;
• and
• a third metal pad disposed partially over both the substrate and the printed circuit board structure, wherein the third metal pad is electrically coupled to the second metal pad through a conductive material or metal and to the light-emitting device through a bonding wire, and wherein the third metal pad is disposed over both the first metal pad and the second metal pad.