Light bar assembly

A light bar assembly, comprising:

• a first substrate, comprising:
• a first edge and a second edge parallel to each other and arranged along a first direction;
• a first connecting end connected to the first edge and the second edge, the first connecting end having a first connecting portion and a second connecting portion, the edge of the first connecting portion protruding further outward than the edge of the second connecting portion;
• a first bonding pad and a second bonding pad disposed on the first substrate, wherein the first bonding pad and the second bonding pad are disposed near the edge of the first connecting portion and the edge of the second connecting portion, respectively;
• and
• a plurality of first solid-state semiconductor light sources disposed interlacedly on the first substrate along the first edge and the second edge, wherein at least one first solid-state semiconductor light source is located beside the first bonding pad of the first connecting portion and partially overlaps the second bonding pad, and at least one first solid-state semiconductor light source is located beside the second bonding pad of the second connecting portion;
• a second substrate, comprising:
• a third edge and a fourth edge parallel to each other and arranged along a first direction;
• a second connecting end connected to the third edge and the fourth edge, the second connecting end having a third connecting portion and a fourth connecting portion, the edge of the third connecting portion protruding further outward than the edge of the fourth connecting portion;
• a third bonding pad and a fourth bonding pad disposed on the second substrate, wherein the third bonding pad and the fourth bonding pad are disposed near the edge of the third connecting portion and the edge of the fourth connecting portion, respectively;
• and
• a plurality of second solid-state semiconductor light sources disposed interlacedly on the second substrate along the third edge and the fourth edge, wherein at least one second solid-state semiconductor light source is located beside the third bonding pad of the third connecting portion and partially overlaps the fourth bonding pad and at least one second solid-state semiconductor light source is located beside the fourth bonding pad of the fourth connecting portion.
• a first connecting device electrically connected to the first bonding pad and the fourth bonding pad, wherein the first connecting device, the first bonding pad, and the fourth bonding pad overlap the second solid-state semiconductor light source closest to the third bonding pad;
• and
• a second connecting device electrically connected to the second bonding pad and the third bonding pad, wherein the second connecting device, the second bonding pad, and the third bonding pad overlap the first solid-state semiconductor light source closest to the first bonding pad;
• wherein the first connecting portion and the second connecting portion of the first substrate complementarily join the fourth connecting portion and the third connecting portion of the second substrate to form a light bar assembly.