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US 8,783,849 B2Granted
Printing method and printing device
AssigneeSeiko Epson Corporation
InventorYuya Haneda
Life of this patent
Estimating the term…
Abstract
A printing method includes: discharging droplets of a liquid curable by active light rays from a nozzle of a discharge head onto a semiconductor device while the semiconductor device is in a heated state; and irradiating the droplets on the semiconductor device using the active light rays.
Claims8
A printing method comprising:
- heating a first surface of a first mounting portion to a predetermined first temperature before a semiconductor device is mounted on the first surface of the first mounting portion;
- mounting the semiconductor device on the first surface of the first mounting portion;
- discharging droplets of a liquid curable by active light rays from a nozzle of a discharge head onto the semiconductor device mounted on the first surface of the first mounting portion while the semiconductor device is in a heated state;
- and
- irradiating the droplets on the semiconductor device mounted on the first surface of the first mounting portion using the active light rays;
- and
- prior to the discharging of the droplets, performing a surface treatment of the semiconductor device by irradiating the semiconductor device with ultraviolet rays,
- wherein the performing of the surface treatment includes heating a second mounting portion to a predetermined second temperature before the semiconductor device is mounted on the second mounting portion,
- mounting the semiconductor device on the second mounting portion, and
- irradiating the semiconductor device mounted on the second mounting portion with the ultraviolet rays while the semiconductor device is heated.
7 more elements
A printing device comprising:
- a first mounting portion configured to mount a semiconductor device thereon;
- a discharge head having a nozzle for discharging, onto the semiconductor device mounted on a first surface of the first mounting portion, droplets of a liquid curable by active light rays;
- a first heating unit installed in the first mounting portion, and configured and arranged to heat the first surface of the first mounting portion to a predetermined first temperature before the semiconductor device is mounted on the first surface of the first mounting portion;
- an irradiation unit configured and arranged to irradiate, using the active light rays, the droplets discharged onto the semiconductor device mounted on the first surface of the first mounting portion;
- and
- a surface treatment unit configured and arranged to irradiate the semiconductor device with ultraviolet rays to perform a surface treatment of the semiconductor device,
- wherein the surface treatment unit includes a second mounting portion configured to mount the semiconductor device thereon,
- a second heating unit installed in the second mounting portion, and configured and arranged to heat the second mounting portion to a predetermined second temperature before the semiconductor device is mounted on the second mounting portion, and
- a treatment portion configured to irradiate the semiconductor device mounted on the second mounting portion with the ultraviolet rays while the semiconductor device is heated.
6 more elements
Dependencies are inferred from the claim text.