Back to results
US 8,783,333 B1Granted
Cooling system
AssigneeEMC Corporation
InventorsJohn K. Bowman, Stephen J. Keefe
Life of this patent
Estimating the term…
Abstract
A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly.
Claims18
A cooling system comprising:
- an evaporator assembly configured to thermally contact a plurality of memory modules and absorb thermal energy from the plurality of memory modules;
- and
- a condenser assembly thermally coupled to the evaporator assembly via a plurality of tubing assemblies, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent memory modules, wherein the condenser assembly is configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly, and wherein each of the plurality of tubing assemblies include a plurality of thermally-conductive deflectable members spaced apart from one another, wherein the plurality of thermally-conductive deflectable members partially encase each of the plurality of tubing assemblies and conform to a shape of each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members separate the plurality of memory modules from directly contacting the plurality of tubing assemblies.
A cooling system comprising:
- an evaporator assembly configured to thermally contact a plurality of heat-producing devices and absorb thermal energy from the plurality of heat-producing devices;
- and
- a condenser assembly thermally coupled to the evaporator assembly via a plurality of tubing assemblies, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent heat-producing devices, wherein the condenser assembly is configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly;
- wherein each of the plurality of tubing assemblies is partially encased in a plurality of thermally-conductive deflectable members spaced apart from one another, wherein the plurality of thermally-conductive deflectable members conform to a shape of each of the plurality of tubing assemblies;
- wherein the plurality of thermally-conductive deflectable members separate the plurality of heat-producing devices from directly contacting the plurality of tubing assemblies.
2 more elements
A cooling system comprising:
- an evaporator assembly configured to thermally contact a plurality of memory modules and absorb thermal energy from the plurality of memory modules;
- a condenser assembly thermally coupled to the evaporator assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporator assembly;
- and
- a plurality of tubing assemblies configured to thermally couple the evaporator assembly with the condenser assembly, wherein at least a portion of each of the plurality of tubing assemblies is located between adjacent memory modules;
- wherein each of the plurality of tubing assemblies include a plurality of thermally-conductive deflectable members spaced apart from one another configured to partially encase each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members conform to a shape of each of the plurality of tubing assemblies, wherein the plurality of thermally-conductive deflectable members contact a surface of the one or more memory modules;
- wherein the plurality of thermally-conductive deflectable members separate the plurality of memory modules from directly contacting the plurality of tubing assemblies.
3 more elements
Dependencies are inferred from the claim text.