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US 8,782,882 B2Granted
Method of manufacturing multi-layer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Dongdong Wang, Takahiro Mori
Life of this patent
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Abstract
A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.
Claims20
A method of manufacturing a printed circuit board, comprising:
- laminating a resin insulating layer on each of two sides of a core member to form a core substrate;
- forming a plurality of penetrating openings in said core substrate by applying laser beams;
- forming a rough surface on said core substrate;
- and
- providing a metal film in each of the penetrating openings to form a plurality of through holes, respectively.
2 more elements
Dependencies are inferred from the claim text.