Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components

An optical proximity sensor, comprising:

• a substrate;
• an infrared light emitter mounted on the substrate and operably connected to and driven by a light emitter driving circuit;
• a light detector also mounted on the substrate and operably connected to and driven by a detector sensing circuit;
• a first molded optically transmissive infrared light pass component disposed over and covering the light emitter;
• a second molded optically transmissive infrared light pass component disposed over and covering the light detector, wherein the second component is discrete and separate from the first component;
• and
• a molded substantially optically non-transmissive infrared light barrier component disposed between and separating the first and second optically transmissive infrared light pass components, wherein the infrared light barrier component, first component, and second component are mounted on a common surface of the substrate, wherein the infrared light barrier component is molded to the first component and the second component, and wherein the infrared light barrier component further covers the light emitter driving circuit and the detector sensing circuit;
• wherein at least a first portion of light emitted by the light emitter passes through the first component, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second component for detection by the light detector, and the infrared light barrier component substantially attenuates or blocks the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector and thereby minimizes optical crosstalk and interference between the light emitter and the light detector.