Semiconductor package structures having liquid cooler integrated with first level chip package modules

An electronic apparatus, comprising:

• a flexible chip carrier substrate having an IC (integrated circuit) chip flip-chip mounted on a surface of the flexible chip carrier;
• a metallic cooler device having upper and lower opposing surfaces and sidewall surfaces, wherein the lower surface of the metallic cooler device is thermally bonded directly to a backside surface of the IC chip;
• and
• a stiffener member that is bonded to the first surface of the flexible chip carrier substrate and is configured to provide mechanical rigidity to the flexible carrier substrate,
• wherein the metallic cooler device is mechanically coupled to the flexible chip carrier substrate by the stiffener member, and
• wherein the stiffener member comprises:
• a rectangular planar frame portion that lies substantially flat against the flexible chip carrier substrate;
• and
• a plurality of extended portions that are integrally formed with the rectangular planar frame portion and extend toward the metallic cooler device and away from the flexible chip carrier substrate at a first angle,
• wherein each the plurality of extended portions includes a bent end portion that is bent with respect to the rest of the extended portions at a second angle, the bent end portions are in contact with the sidewall surfaces of the metallic cooler device, the bent end portions of the plurality of extended portions being integrally formed with the rest of the extended portions, and
• wherein the plurality of extended portions are disposed against the metallic cooler device with a compressive force such that the metallic cooler device is configured to receive a downward tension directly from the plurality of extended portions.