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US 8,772,924 B2Granted
Forming in-situ micro-feature structures with coreless packages
AssigneeIntel Corporation
InventorsRavi Nalla, Mathew J. Manusharow
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Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.
Claims7
A structure comprising:
- a die disposed in a package structure;
- a dielectric material adjacent the die;
- die pad interconnect structures in the die area;
- and
- at least one micro-feature structure disposed on a top portion of the die, wherein the at least one micro-feature structure is disposed directly on an etch stop material disposed directly on the die.
2 more elements
Dependencies are inferred from the claim text.