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US 8,772,923 B2Granted
Semiconductor device having leads with cutout and method of manufacturing the same
AssigneePanasonic Corporation
InventorMasanori Minamio
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: leads (5) in each of which a cutout (5a) is formed; a die pad (11); a power element (1) held on the die pad (11); and a package (6) made of a resin material, and configured to encapsulate inner end portions of the leads (5), and the die pad (11) including the power element (1). The cutout (5a) is located in a region of each of the leads (5) including a portion of the lead (5) located at a boundary between the lead (5) and the package (6), and is filled with a resin material.
Claims16
A semiconductor device, comprising:
- leads in each of which a cutout is formed;
- a die pad;
- a first element held on the die pad;
- and
- a package made of a first resin material, and configured to encapsulate inner end portions of the leads, and the die pad including the first element, wherein
- a portion of the cutout is inside the package, another portion of the cutout is outside the package, and the portion of the cutout inside the package and the another portion of the cutout outside the package are filled with a second resin material, and
- the second resin material with which the cutout is filled is connected integrally to the resin material forming the package.
4 more elements
A method of manufacturing a semiconductor device, the method comprising:
- preparing a die pad on which a first element is held, and leads each having a cutout, said cutout having a portion inside a package and another portion outside the package;
- and
- clamping the cutout of each of the leads between molds, and injecting an encapsulating resin material between the molds to fill the portion of the cutout inside the package and the another portion of the cutout outside the package with the resin material so as to integrally encapsulate inner end portions of the leads and the die pad including the first element with the resin material.
Dependencies are inferred from the claim text.