Interposer for semiconductor package

A device package comprising:

• an interposer which includes an interposer base having first and second surfaces;
• a redistribution layer disposed on a first surface of the interposer base;
• interposer pads coupled to the redistribution layer;
• interposer vias through the interposer base in communication with the redistribution layer;
• interposer contacts coupled to the interposer pads via the redistribution layer, wherein an interposer contact includes a via portion disposed in the interposer via and a surface portion on the second surface of the interposer base, wherein the via portion and surface portion comprise a single material, and the interposer contact is a single unitary contact of which no seam or interface exist between the via portion and the surface portion;
• a die comprising die contacts, the die contacts coupled to the interposer pads;
• and
• a package substrate having package pads on a first surface, wherein the interposer contacts are coupled to the package pads.