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US 8,772,919 B2Granted
Image sensor package with trench insulator and fabrication method thereof
OwnerWen-Cheng Chien, Wen-Ken Huang +2inventors
InventorsWen-Cheng Chien, Wen-Ken Huang, Chien-Hung Liu, Joey Lai
Life of this patent
Estimating the term…
Abstract
The invention provides a chip package and a fabrication method thereof. In one embodiment, the chip package includes: a substrate having a semiconductor device and a conductive pad thereon; an insulator ring filling a trench formed in the substrate, wherein the insulator ring surrounds an intermediate layer below the conductive pad; and a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad.
Claims26
A chip package, comprising:
- a substrate having a semiconductor device and a conductive pad thereon;
- an insulator ring filling a trench formed in the substrate, wherein the insulator ring coaxially surrounds an intermediate layer that comprises a material of the substrate coaxially surrounded by the trench, wherein the insulator ring, the intermediate layer and the trench form a coaxial structure directly below the conductive pad, wherein the insulator ring, the intermediate layer and the trench are coaxially located directly below the conductive pad;
- and
- a conductive layer disposed below a backside of the substrate and electrically connected to the conductive pad through the coaxial structure.
1 more element
A chip package, comprising:
- a substrate having a semiconductor device and a conductive pad supported thereon;
- and
- a coaxial structure in the substrate directly below the conductive pad, wherein said coaxial structure comprises an insulator ring and an intermediate layer comprising a material of the substrate coaxially disposed within the insulator ring, and wherein both the insulator ring and the intermediate layer are located directly below the conductive pad.
A chip package, comprising:
- a substrate;
- a semiconductor device supported on the substrate;
- a plurality of conductive pads supported on the substrate;
- and
- a plurality of coaxial structures formed in the substrate, wherein each coaxial structure is located directly below a different one of the plurality of conductive pads, and wherein each coaxial structure comprises an insulator ring and an intermediate layer comprising a material of the substrate coaxially surrounded by the insulator ring.
2 more elements
Dependencies are inferred from the claim text.