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US 8,772,912 B2Granted
Electronic device
AssigneeDenso Corporation
InventorsShotaro Miyawaki, Katsuhiko Kawashima, Atsushi Kashiwazaki, Takashi Yoshimizu
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Abstract
An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.
Claims12
An electronic device comprising:
- a heat sink;
- a substrate constituting an electronic circuit, the substrate being mounted on the heat sink;
- a coating layer disposed on the substrate, the coating layer being made of one of a polyimide-based resin and a polyamideimide-based resin;
- a lead frame having a fixing terminal;
- an adhesive layer fixing the fixing terminal to the heat sink, the adhesive layer being made of the same material as the coating layer;
- and
- a mold resin sealing the substrate and the lead frame,
- the substrate being a hybrid IC substrate having a wiring board and an electronic part integrated with and mounted on the wiring board,
- the coating layer being disposed on a surface of the substrate opposite to the heat sink, and
- the mold resin being disposed directly on a top and side surfaces of the coating layer and completely surrounding the top and side surfaces of the coating layer.
7 more elements
Dependencies are inferred from the claim text.