US 8,772,885 B2Granted

MEMS sensing device and method for the same

AssigneePixArt Imaging Incorporation, R.O.C.

InventorsChuan-Wei Wang, Ming-Han Tsai

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Abstract

The present invention discloses a MEMS sensing device which comprises a substrate, a MEMS device region, a film, an adhesive layer, a cover, at least one opening, and a plurality of leads. The substrate has a first surface and a second surface opposite the first surface. The MEMS device region is on the first surface, and includes a chamber. The film is overlaid on the MEMS device region to seal the chamber as a sealed space. The cover is mounted on the MEMS device region and adhered by the adhesive layer. The opening is on the cover or the adhesive layer, allowing the pressure of the air outside the device to pressure the film. The leads are electrically connected to the MEMS device region, and extend to the second surface.

Claims8

Dependent claims

A MEMS (Micro-Electro-Mechanical System) sensing device, comprising:

a substrate having a first surface and a second surface opposite the first surface;
a MEMS device region on the first surface of the substrate, the MEMS device region including a chamber and a multilayer structure;
a mask layer covering the multilayer structure, the mask layer having at least one mask opening which exposes the chamber;
a film overlaying on the mask layer to seal the at least one mask opening so that the chamber is sealed as a sealed space;
an adhesive layer disposed on the film;
at least one opening located on the adhesive layer whereby the adhesive layer does not form a sealed space;
a cover mounted on the MEMS device region and adhered by the adhesive layer;
and
a plurality of leads electrically connected to the MEMS device region and extending to the second surface.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/948,128Filed 22 Jul 2013 · division
Priority: TW 100111075 A30 Mar 2011
Published: US 2013/0334623 A119 Dec 2013
Granted: 8 Jul 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

B81B 3/0021
Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors,…:…
B81C 1/00333
Processes for packaging MEMS devices: aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
G01L 9/0073
Using variations in capacitance: using a semiconductive diaphragm
B81C 2203/0118
Packaging MEMS: bonding a wafer on the substrate, i.e. where the cap consists of another wafer

Family

Application13/134,262Parent of this division · filed 3 Jun 2011
US 2013/0334623 A1Pre-grant publication · published 19 Dec 2013
US 8,519,491 B2Parent of this division
US 2012/0248555 A1Published application
US 8,772,885 B2This patent

From the US filing history. Foreign family members aren’t listed.

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