Integrally molded die and bezel structure for fingerprint sensors and the like
AssigneeApple Inc.
InventorsRobert Henry Bond, Alan Kramer, Giovanni Gozzini
Life of this patent
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Abstract
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
Claims32
A fingerprint sensor device, comprising:
- a substrate;
- a die comprising fingerprint sensing circuitry and being secured to said substrate;
- a first conductive bezel secured to said substrate adjacent said die;
- and
- an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel;
- said die including a top surface configured to be electrically coupled with a fingertip;
- said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip.
A fingerprint sensor assembly comprising:
- a substrate;
- a die comprising a fingerprint sensing array and secured to said substrate;
- a first conductive bezel secured to said substrate adjacent said die;
- a second conductive bezel secured to said substrate adjacent said die such that said die is between said first and second conductive bezels;
- and
- an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, such that said fingerprint sensing array and at least a portion of a top surface of each of said first conductive bezel and said second conductive bezel are configured to be electrically coupled with a fingertip.
A method of making a fingerprint sensor device, the method comprising:
- securing a die comprising fingerprint sensing circuitry to a substrate;
- securing a first conductive bezel to said substrate adjacent said die;
- and
- integrally encasing at least a portion of said die and a portion of said first conductive bezel with an encapsulation structure;
- said die including a top surface configured to be electrically coupled with a fingertip;
- said first conductive bezel including a top surface positioned with respect to the top surface of said die and configured to be electrically coupled with the fingertip.
Dependencies are inferred from the claim text.