Light emitting diode package structure and manufacturing method thereof

A light emitting diode (LED) package structure, comprising:

• a fluorescent substrate having a first surface and a second surface opposite the first surface, the fluorescent substrate comprising a fluorescent material and a glass material, the fluorescent substrate having a through hole that traverses through the fluorescent substrate from the first surface to the second surface;
• a first electrically conductive pattern disposed on the first surface of the fluorescent substrate;
• a second electrically conductive pattern disposed on the second surface of the fluorescent substrate;
• an electrically conductive component filled in the through hole and connecting the first electrically conductive pattern and the second electrically conductive pattern;
• and
• a plurality of LED chips including first and second LED chips disposed on the second surface of the fluorescent substrate with the first LED chip aligned with the through hole and the second LED chip not aligned with the through hole, each of the first and second LED chips having a light extraction surface coupled to the second electrically conductive pattern such that the first and second LED chips are electrically coupled to the first electrically conductive pattern via the second electrically conductive pattern and the electrically conductive component.