Organic light emitting diode device and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsKie Hyun Nam, Sang-Joon Seo, Sung-Guk An
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Abstract
An organic light emitting diode device and a manufacturing method thereof. The organic light emitting diode device includes a substrate main body, a transparent electrode formed on the substrate main body, an organic emission layer formed on the transparent electrode, a cover electrode formed on the organic emission layer and made of a metal, and a sealant formed on the substrate main body to overlap an edge of the cover electrode and cover a side surface of the organic emission layer.
Claims19
An organic light emitting diode device, comprising:
- a substrate main body;
- a transparent electrode formed on the substrate main body;
- an organic emission layer formed on the transparent electrode;
- a cover electrode formed on the organic emission layer and made of a metal, the cover electrode including an oxide film formed on a first surface of the cover electrode opposite to a second surface of the cover electrode facing the organic emission layer, the oxide film being formed by oxidation of the metal of the first surface, the cover electrode having a thickness in a range of approximately 150 nm to approximately 5000 nm, the oxide film being thin in comparison with the metal of the cover electrode;
- and
- a sealant formed on the substrate main body to overlap an edge of the cover electrode and cover a side surface of the organic emission layer,
- the cover electrode and the sealant effectively suppressing the permeation of moisture or oxygen into the organic emission layer.
An organic light emitting diode device, comprising:
- a substrate main body;
- a transparent electrode formed on the substrate main body;
- an organic emission layer formed on the transparent electrode;
- a cover electrode formed on the organic emission layer and being formed of at least one metal selected from aluminum (Al), silver (Ag), gold (Au), and magnesium (Mg), the cover electrode including an oxide film formed on a first surface of the cover electrode opposite to a second surface of the cover electrode facing the organic emission layer, the oxide film being formed by oxidation of the metal of the first surface, the cover electrode having a thickness in a range of approximately 150 nm to approximately 5000 nm, the oxide film being thin in comparison with the metal of the cover electrode;
- and
- a sealant formed on the substrate main body to overlap an edge of the cover electrode and cover a side surface of the organic emission layer,
- the cover electrode and the sealant effectively suppressing the permeation of moisture or oxygen into the organic emission layer.
A method for manufacturing an organic light emitting diode device, comprising:
- providing a substrate main body;
- forming a transparent electrode on the substrate main body;
- forming an organic emission layer on the transparent electrode;
- forming a cover electrode including an oxide film by forming a metal layer on the organic emission layer and oxidizing a first surface of the metal layer opposite to a second surface of the metal layer facing the organic emission layer, the cover electrode having a thickness in a range of approximately 150 nm to approximately 5000 nm, the oxide film being thin in comparison with the metal of the cover electrode;
- and
- forming a sealant covering a side surface of the organic emission layer on the substrate main body,
- the cover electrode and the sealant effectively suppressing the permeation of moisture or oxygen into the organic emission layer.
Dependencies are inferred from the claim text.