Carrier with three-dimensional capacitor
AssigneeChipbond Technology Corporation
InventorsChih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu
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AssigneeChipbond Technology Corporation
InventorsChih-Ming Kuo, Lung-Hua Ho, You-Ming Hsu
Estimating the term…
A carrier with three-dimensional capacitor includes a substrate and a three-dimensional capacitor, wherein the substrate comprises a trace layer having a first terminal and a second terminal. The three-dimensional capacitor is integrally formed as one piece with the trace layer. The three-dimensional capacitor and the trace layer are made of same material. The three-dimensional capacitor comprises a first capacitance portion and a second capacitance portion, the first capacitance portion comprises a first section, a second section and a first passage, the second capacitance portion is formed at the first passage. The second capacitance portion comprises a third section, a fourth section and a second passage communicated with the first passage. The first capacitance portion is located at the second passage, a first end of the first capacitance portion connects to the first terminal, and a third end of the second capacitance portion connects to the second terminal.
A carrier with three-dimensional capacitor at least includes:
Dependencies are inferred from the claim text.