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AssigneeCytec Technology Corp.
InventorsJunjie Jeffrey Sang, Dalip Kumar Kohli
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Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
A composite structure comprising an electrically conductive surfacing film formed on a composite substrate,
An electrically conductive surfacing film capable of providing lightning strike protection and electromagnetic interference shielding, said surfacing film comprising silver flakes distributed substantially uniformly throughout the film in a substantially interconnected, lamellar configuration, and formed from a curable thermosetting composition comprising:
Dependencies are inferred from the claim text.