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US 8,772,214 B2Granted
Aqueous cleaning composition for removing residues and method using same
AssigneeAir Products and Chemicals, Inc.
InventorsAiping Wu, Roberto John Rovito
Life of this patent
Estimating the term…
Abstract
A composition and method for removing residues such as, without limitation, post etched and/or post ashed photoresist, plasma etching, ashing, and mixtures thereof from a substrate is described herein. In one aspect, there is provided a method for removing residues from a substrate comprising: contacting the substrate with a composition comprising: water; a quaternary ammonium hydroxide compound; a fluoride containing compound; and optionally a corrosion inhibitor wherein the composition is free of an added organic solvent and wherein the composition has a pH greater than 9.
Claims20
A composition for removing residues from a substrate, the composition consisting of:
- water;
- a quaternary ammonium hydroxide compound comprising a compound having a general formula [N-R1R2R3R4]+OH−wherein R1, R2, R3, and R4 are each independently an alkyl group, a hydroxyalkyl group, and mixtures thereof;
- a fluoride containing compound comprising at least one selected from the group consisting of a compound having a general formula R5R6R7R8NF where R5, R6, R7 and R8 are each independently hydrogen, an alcohol group, an alkoxy group, an alkyl group, and mixtures thereof;
- hydrofluoric acid;
- choline fluoride;
- aluminum hexafluoride;
- fluoride salt of an amine;
- and mixtures thereof;
- optionally a corrosion inhibitor selected from the group consisting of an organic acid, an organic acid salt, catechol, resorcinol, a phenol, maleic anhydride, phthalic anhydride, pyrogallol, gallic acid or esters thereof, benzotriazole, carboxybenzotriazole, diethylhydroxlamine, fructose, ammonium thiosulfate, glycine, tetramethylguanidine, iminodiacetic acid, thioglycerol, triazole, dimethylacetamide, mercapto-group containing compound and combinations thereof;
- and
- optionally an additive selected from the group consisting of a surfactant, a chelating agent, a dye, a biocide, and combinations thereof,
- wherein the composition is free of an added organic solvent and
- wherein the composition has a pH greater than 9.
10 more elements
A method for defining a pattern comprising the steps of:
- coating a photoresist onto a substrate,
- lithographically defining a pattern on the photoresist;
- transferring the pattern onto at least a portion of the substrate;
- etching the pattern into the substrate to form a patterned substrate;
- exposing the patterned substrate to an activated reactive gas to remove at least a portion of the photoresist and provide a residue;
- removing the residue from the substrate by contacting the substrate with a composition consisting of:
- water;
- a quaternary ammonium hydroxide compound comprising a compound having a general formula [N-R1R2R3R4]+OH−wherein R1, R2, R3, and R4 are each independently an alkyl group, a hydroxyalkyl group, and mixtures thereof;
- a fluoride containing compound comprising at least one selected from the group consisting of a compound having a general formula R5R6R7R8NF where R5, R6, R7 and R8 are each independently hydrogen, an alcohol group, an alkoxy group, an alkyl group, and mixtures thereof;
- hydrofluoric acid;
- choline fluoride;
- aluminum hexafluoride;
- fluoride salt of an amine;
- and mixtures thereof;
- optionally a corrosion inhibitor selected from the group consisting of an organic acid, an organic acid salt, catechol, resorcinol, a phenol, maleic anhydride, phthalic anhydride, pyrogallol, gallic acid or esters thereof, benzotriazole, carboxybenzotriazole, diethylhydroxlamine, fructose, ammonium thiosulfate, glycine, tetramethylguanidine, iminodiacetic acid, thioglycerol, triazole, dimethylacetamide, mercapto-group containing compound and combinations thereof;
- and
- optionally an additive selected from the group consisting of a surfactant, a chelating agent, a dye, a biocide, and combinations thereof,
- wherein the composition is substantially free of an added organic solvent and wherein the composition has a pH greater than 9.
15 more elements
A method for removing residues from a substrate comprising:
- contacting the substrate with a composition consisting of:
- from 65 to 99.9% by weight of water;
- from 0.5 to 15% by weight of a quaternary ammonium hydroxide compound comprising a compound having a general formula [N-R1R2R3R4]+OH−wherein R1, R2, R3, and R4 are each independently an alkyl group, a hydroxyalkyl group, and mixtures thereof;
- from 0.1 to 10% by weight of a fluoride-containing compound comprising at least one selected from the group consisting of a compound having a general formula R5R6R7R8NF where R5, R6, R7 and R8 are each independently hydrogen, an alcohol group, an alkoxy group, an alkyl group, and mixtures thereof;
- hydrofluoric acid;
- choline fluoride;
- aluminum hexafluoride;
- fluoride salt of an amine;
- and mixtures thereof;
- and optionally from 0 to 10% by weight a corrosion inhibitor selected from the group consisting of an organic acid, an organic acid salt, catechol, resorcinol, a phenol, maleic anhydride, phthalic anhydride, pyrogallol, gallic acid or esters thereof, benzotriazole, carboxybenzotriazole, diethylhydroxlamine, fructose, ammonium thiosulfate, glycine, tetramethylguanidine, iminodiacetic acid, thioglycerol, triazole, dimethylacetamide, mercapto-group containing compound and combinations thereof;
- and
- optionally from 0 to about 5% by weight of an additive selected from the group consisting of a surfactant, a chelating agent, a dye, a biocide, and combinations thereof,
- wherein the composition is substantially free of an added organic solvent and wherein the composition has a pH greater than 9.
10 more elements
Dependencies are inferred from the claim text.