Pattern forming method, pattern forming apparatus, and method for manufacturing semiconductor device

A pattern forming method using a template containing a pattern comprising at least one protrusion and at least one recess forming a pattern region that is transferred into a resin on a substrate resulting in a reverse image of the pattern of the pattern region on the substrate,

• the pattern forming method comprising:
• coating the resin on the substrate;
• curing a first portion of the resin and the partial curing of a second portion of the resin;
• moving the template and/or the substrate toward one another to provide contact with the first portion of the resin and a portion of the template that does not include the pattern region;
• measuring an opposing force exerted on the template during the contacting;
• stopping the moving when the opposing force reaches a predetermined value, such that a gap is formed between the template and the substrate;
• transferring the pattern region to the second portion of the resin;
• and
• curing the resin to completion.

A method for manufacturing a semiconductor device, the method comprising a pattern forming method using a template containing a base and a pattern that has at least one of a recess or at least one protrusion forming a pattern region that is transferred onto a resin on a substrate resulting in a reverse image of the pattern region on the substrate,

• the pattern forming method comprising:
• coating the resin on the substrate;
• adjusting a hardness of the resin so that the hardness of a first portion of the resin is greater than the hardness of a second portion of the resin;
• maintaining a gap between a base of the template and the substrate by bringing the first portion into contact with a portion of the template that does not include the pattern region;
• transferring the pattern region to the second portion of the resin;
• and
• curing the resin.

A method for manufacturing a semiconductor device, the method comprising a pattern forming method using a template containing a pattern comprising at least one protrusion or at least one depression forming a pattern region that is transferred onto a resin on a substrate resulting in a reverse image of the pattern region on the substrate,

• the pattern forming method comprising:
• coating the resin on the substrate;
• partially curing the resin;
• completely curing a first portion of the resin and partially curing of a second portion of the resin;
• moving the template and/or the substrate towards one another to provide contact between the first portion of the resin and a portion of the template that does not include the pattern region;
• measuring an opposing force exerted on the template during the contacting;
• stopping the moving when the opposing force reaches a predetermined value, such that a gap is formed between the template and the substrate;
• transferring the pattern region to the second portion;
• and
• completely curing the second portion of the resin.