Method for forming an adhesive layer and adhesive composition

An adhesive composition to be employed in a forming method of an adhesive layer on a wafer comprising selectively coating, on a surface of the wafer to be bonded, an adhesive composition containing a thermosetting composition, first and second kinds of hardening reactive compositions, the first hardening reactive composition having reactive property at a first temperature and the second hardening reactive composition having reactive property at a second temperature higher than the first temperature, and an organic solvent using a noncontact coating device;

• and removing the organic solvent from the adhesive composition coated on the surface to be bonded,
• the adhesive composition comprising an epoxy resin, an epoxy curing agent, and a first curing accelerator which are reacted through a first hardening reaction exhibiting a first DSC peak within a first temperature range of 100 to 160° C., and a second hardening reaction relating to a self-polymerization of the epoxy resin and a second curing accelerator and exhibiting a second DSC peak within a second temperature range of 140 to 200° C.,
• wherein the first curing accelerator is different from the second curing accelerator.

An adhesive composition to be employed in a forming method of an adhesive layer on a wafer,

• the adhesive composition containing a thermosetting composition, first and second kinds of hardening reactive compositions with respective first and second kinds of curing accelerators, the first hardening reactive composition having reactive property at a first temperature and the second hardening reactive composition having reactive property at a second temperature higher than the first temperature, and an organic solvent,
• wherein the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures
• wherein the first kind of curing accelerator is different from the second kind of curing accelerator.