Method and apparatus for semiconductor device fabrication using a reconstituted wafer

A method of fabricating a semiconductor device, the method comprising:

• placing a first plurality of diced chips in a frame having through openings, wherein a chip placed within one through opening in the frame is separated from another chip placed within an adjacent through opening in the frame by a portion of the frame;
• forming a first reconstituted wafer by filling a mold compound into the through openings, the mold compound being formed around the chips, wherein a height of the through openings is greater than a thickness of each of the first plurality of diced chips, wherein a portion of the mold compound covers a major surface of the first plurality of diced chips after forming the first reconstituted wafer;
• forming a first plurality of finished dies within the reconstituted wafer by forming a first redistribution layer comprising first redistribution metal lines over the first plurality of diced chips and the frame;
• and
• after forming the first redistribution layer comprising first redistribution metal lines, separating the first plurality of finished dies from the frame,
• after separating the first plurality of finished dies from the frame, placing a second plurality of diced chips in the through openings of the frame;
• forming a second reconstituted wafer by filling the mold compound into the through openings;
• forming a second plurality of finished dies within the second reconstituted wafer by forming a second redistribution layer comprising second redistribution metal lines over the second plurality of diced chips and the frame;
• and
• after forming the second redistribution layer comprising second redistribution metal lines, separating the second plurality of finished dies from the frame.

A method of fabricating a semiconductor device, the method comprising:

• placing a reusable frame over a carrier;
• placing diced semiconductor chips within through openings in the reusable frame, wherein a chip placed within one through opening in the reusable frame is separated from another chip placed within an adjacent through opening in the reusable frame by a portion of the reusable frame;
• forming a reconstituted wafer by filling a mold compound into the through openings, the mold compound being formed around the chips;
• separating the reusable frame with the reconstituted wafer from the carrier;
• after separating the reusable frame with the reconstituted wafer from the carrier, forming metallization layers over the reconstituted wafer to form finished dies;
• and
• after forming the metallization layers, separating the finished dies from the reusable frame while keeping the reusable frame intact.