Disabling electrical connections using pass-through 3D interconnects and associated systems and methods

A method of manufacturing a stacked system of microelectronic dies comprising:

• disabling a first electrostatic discharge (ESD) device from first internal circuitry of a first microelectronic die by forming at least one dielectric liner;
• attaching a second microelectronic die to the first die in a stacked arrangement, wherein the second die has second internal circuitry and a second ESD device electrically coupled to the second internal circuitry, and wherein attaching the second die to the first die electrically couples the second ESD device to the first internal circuitry such that second ESD device protects the first internal circuitry and the second internal circuitry from electrostatic energy.

A method of manufacturing a microelectronic workpiece, the method comprising:

• forming at least one dielectric liner in a microelectronic substrate that carries a first circuit and a second circuit electrically connected to each other via a conduction path in the substrate, the dielectric liner being formed through the conduction path to electrically disconnect the first circuit and the second circuit from each other.