Integrated circuit package architecture
AssigneeAltera Corporation
InventorWilliam Y. Hata
Life of this patent
Estimating the term…
Abstract
A packaging architecture for an integrated circuit is provided. The architecture includes a printed circuit board and a package substrate disposed on the printed circuit board. A first integrated circuit is disposed on a first surface of the package substrate. The package substrate is capable of supporting a second integrated circuit. The second integrated circuit is in electrical communication with a plurality of pads disposed on the first surface of the package substrate. Each of the plurality of pads is in electrical communication with the printed circuit board without communicating with the first integrated circuit.
Claims20
A method of packaging an integrated circuit, comprising:
- coupling a first integrated circuit to a package substrate;
- coupling a second integrated circuit to the package substrate, the second integrated circuit disposed over the first integrated circuit;
- and
- coupling the package substrate to a printed circuit board such that the second integrated circuit communicates data to the first integrated circuit exclusively through the printed circuit board prior to being delivered to the first integrated circuit.
A method of packaging an integrated circuit, comprising:
- coupling a first integrated circuit to a package substrate;
- placing a second integrated circuit above the first integrated circuit;
- coupling the second integrated circuit to the package substrate;
- coupling the first integrated circuit to a printed circuit board, by the package substrate;
- and
- coupling the second integrated circuit to the printed circuit board, by the package substrate, wherein all communication from the first integrated circuit to the second integrated circuit and from the second integrated circuit to the first integrated circuit occurs by way of the printed circuit board.
Dependencies are inferred from the claim text.