Method for hybrid encapsulation of an organic light emitting diode

A method for forming an encapsulating layer on an organic light emitting diode (OLED) substrate, comprising:

• forming a first sublayer of a hybrid layer having a majority of inorganic materials and a minority of organic materials on a region of a substrate having an OLED structure disposed thereon by providing an oxygen-containing gas to a HMDSO gas at a flow ratio of about 10 or greater;
• forming a middle sublayer of the hybrid layer having a majority of organic materials and a minority of inorganic materials in physical contact with the first sublayer by decreasing the flow ratio of the oxygen-containing gas to the HMDSO gas to less than about 2;
• and
• forming a second sublayer of the hybrid layer having a majority of inorganic materials and a minority of organic materials in physical contact with the middle sublayer by increasing the flow ratio of the oxygen-containing gas to the HMDSO gas to about 10 or greater.

A method for forming an encapsulating layer on an organic light emitting diode (OLED) substrate, comprising:

• forming a first inorganic layer on a region of a substrate having an OLED structure disposed thereon;
• forming a hybrid layer on the first inorganic layer, wherein the hybrid layer comprises:
• a first sublayer having a majority of inorganic materials and a minority of organic materials;
• a middle sublayer having a majority of organic materials and a minority of inorganic materials;
• and
• a second sublayer having a majority of inorganic materials and a minority of organic materials, wherein the first sublayer, the middle sublayer, and the second sublayer are all formed by supplying a processing gas comprising a HMDSO gas during the formation of each of the first sublayer, the middle sublayer, and the second sublayer;
• and
• forming a second inorganic layer on the hybrid layer.