Method for making a redistributed wafer using transferrable redistribution layers

A method of making electronic devices with redistribution layers comprising:

• providing a wafer comprising a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads;
• forming redistribution layers on a temporary substrate and comprising a first layer having a pattern of contact areas forming wafer bonding pads matching the die pads, a third layer having a pattern of contact areas forming redistributed pads different than the wafer bonding pads, and a second layer having a pattern of interconnecting portions coupling the wafer bonding pads to the redistributed pads, with each interconnecting portion having a first contact area pattern and a second contact area pattern coupled thereto so that the first and second contact area patterns are laterally offset from one another;
• testing the provided wafer comprising a plurality of electronic devices;
• coupling the die pads of the wafer to the wafer bonding pads on the redistribution layers;
• removing the temporary substrate from the redistribution layers;
• forming interconnect structures on the redistributed pads on the redistribution layers;
• and
• dividing the coupled wafer and redistribution layers into a plurality of redistributed electronic devices.

A method of making electronic devices with redistribution layers comprising:

• providing a wafer comprising a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads;
• forming redistribution layers on a temporary substrate and comprising a first layer having a pattern of contact areas forming wafer bonding pads matching the die pads, a third layer having a pattern of contact areas forming redistributed pads different than the wafer bonding pads, and a second layer having a pattern of interconnecting portions coupling the wafer bonding pads to the redistributed pads, with each interconnecting portion having a first contact area pattern and a second contact area pattern coupled thereto so that the first and second contact area patterns are laterally offset from one another;
• testing the redistribution layers;
• coupling the die pads to the wafer bonding pads;
• removing the temporary substrate;
• forming interconnect structures on the redistributed pads of the redistribution layers, and
• dividing the coupled wafer and redistribution layers into a plurality of redistributed electronic.