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US 8,771,540 B2Granted
Highly dilutable polishing concentrates and slurries
AssigneeFujifilm Planar Solutions, LLC
InventorsHyungjun Kim, Richard Wen, Bin Hu, Minae Tanaka, Deepak Mahulikar
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Abstract
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
Claims14
A method of preparing a chemical mechanical polishing slurry, comprising:
- adding water and oxidizer to a concentrate, wherein said concentrate comprises:
- about 0.5 wt % to about 10 wt %, based on the total weight of the concentrate, of an abrasive;
- about 1 wt % to about 20 wt %, based on the total weight of the concentrate, of a complexing agent;
- and
- a corrosion inhibitor,
- wherein said water and said oxidizer are added to said concentrate in an amount governed by the formula:
- 0.8≦[oxidizer]/f≦2.0,
- wherein ƒ=A+B*[complexing agent]C,
- wherein A is between 0.35 and 0.8, B is between 0.3 and 0.5, and C is about 1, and
- [oxidizer] and [complexing agent] are the amounts of the oxidizer and complexing agent in the chemical mechanical polishing slurry, respectively, to form the chemical mechanical polishing slurry.
7 more elements
Dependencies are inferred from the claim text.