Method of encapsulating an electronic arrangement
AssigneeTesa SE
InventorsKlaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen
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Abstract
The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
Claims21
A method of encapsulating an electronic arrangement with respect to permeants, comprising encapsulating an electronic arrangement by completely enclosing the arrangement with an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride modified vinylaromatic block copolymers.
Dependencies are inferred from the claim text.