US 8,770,690 B2Granted

Element substrate and printed wiring board

AssigneeCanon Kabushiki Kaisha

InventorKengo Umeda

Life of this patent

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Abstract

An element substrate includes a plurality of terminals, a first receiving circuit and a second receiving circuit each receiving a differential signal via one of the terminals included in the plurality of terminals, a driving circuit including a first input unit for inputting a first signal and a second input unit for inputting a second signal and driving a driving element based on the first signal and the second signal, and a setting circuit for setting a first connection state of connecting an output from the first receiving circuit to the first input unit and connecting an output from the second receiving circuit to the second input unit, and a second connection state of connecting an output from the first receiving circuit to the second input unit and connecting an output from the second receiving circuit to the first input unit based on an externally input signal.

Claims5

Dependent claims

An element substrate comprising:

a first terminal and a second terminal each for receiving a signal;
a third terminal for receiving a control signal;
a first receiving circuit configured to receive a signal via the first terminal;
a second receiving circuit configured to receive a signal via the second terminal;
a driving circuit including a first receiving portion for receiving a first signal and a second receiving portion for receiving a second signal and configured to drive a driving element based on the first signal and the second signal;
a switch circuit configured to switch between a first connection state in which an output of the first receiving circuit is connected to the first receiving portion and an output of the second receiving circuit is connected to the second receiving portion, and a second connection state in which the output of the first receiving circuit is connected to the second receiving portion and the output of the second receiving circuit is connected to the first receiving portion;
and
a setting circuit configured to set either the first connection state or the second connection state based on the control signal.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/855,531Filed 2 Apr 2013 · continuation
Priority: JP 2010-11229114 May 2010
Published: US 2013/0222451 A129 Aug 2013
Granted: 8 Jul 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H03K 17/16
Electronic switching or gating, i.e. not by contact-making and –breaking: modifications for eliminating interference voltages or currents
B41J 2/04541
Control methods or devices therefor, e.g. driver circuits, control circuits: specific driving circuit
B41J 2/0458
Control methods or devices therefor, e.g. driver circuits, control circuits: controlling heads based on heating elements forming bubbles
H05K 1/025
High frequency adaptations: impedance arrangements, e.g. impedance matching, reduction of parasitic impedance

Family

Application12/963,199Parent of this continuation · filed 8 Dec 2010
US 2013/0222451 A1Pre-grant publication · published 29 Aug 2013
US 8,432,183 B2Parent of this continuation
US 2011/0279166 A1Published application
US 8,770,690 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

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