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US 8,770,462 B2Granted
Solder paste transfer process
AssigneeRaytheon Company
InventorsWilliam D. Beair, Michael R. Williams, Eric Gilley
Life of this patent
Estimating the term…
Abstract
A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.
Claims7
A system, comprising:
- a device layer surface on which multiple electrical components are disposed and multiple solder pad locations are defined remotely from the multiple electrical components;
- and
- a solder paste transfer tool fixture including a fixture body and multiple transfer tools extending from the fixture body in an arrangement that is reflective of a formation of the multiple solder pad locations,
- each of the multiple transfer tools comprising a surface onto which solder paste is applicable the surfaces being non-wettable with respect to the solder paste during an elevated temperature condition at which the solder paste is reflowable from the surfaces, and
- the fixture body being disposable proximate to the device layer surface with the multiple transfer tools interleaved between the multiple electrical components and each of the respective surfaces of each of the multiple transfer tools facing corresponding ones of the multiple solder pad locations.
2 more elements
Dependencies are inferred from the claim text.