Sensor assembly and sensor module

A sensor assembly comprising:

• a sensor element;
• and
• an exterior packaging bag enclosing the sensor element,
• the sensor element comprising:
• a sensor thin film comprising one of resin and elastomer, the sensor thin film further comprising cracks;
• and
• at least one pair of electrodes connected to the sensor thin film,
• wherein the exterior packaging bag comprises a laminate film having a metal foil and two resin layers sandwiching the metal foil,
• the sensor thin film comprises conductive filler filled at a filling rate of 30% or more by volume in a resin parent material;
• three-dimensional conductive paths are provided in the sensor thin film via contact among particles of the conductive filler;
• and
• the sensor element further comprises an insulating base material on a surface of the sensor thin film, and detects deformation of a measured object based on an increase in electrical resistance due to a bending deformation of the sensor thin film,
• the sensor element further comprises an elastically deformable cover film covering the sensor thin film;
• and
• the cracks are provided in advance and extend in a direction such that the conductive paths are cut off when a bending deformation occurs.

A sensor module comprising:

• a sensor assembly;
• and
• a circuit case on which the sensor assembly is installed, wherein
• the sensor assembly comprises:
• a sensor element;
• and
• an exterior packaging bag enclosing the sensor element,
• the sensor element comprises:
• a sensor thin film comprising one of resin and elastomer;
• and
• at least one pair of electrodes connected to the sensor thin film,
• the exterior packaging bag comprises a laminate film having a metal foil and two resin layers sandwiching the metal foil
• the exterior packaging bag of the sensor assembly has an opening;
• the sensor element has a wiring unit projecting out of the exterior packaging bag from the opening;
• and
• the circuit case has a box-like shape and comprises
• a case body on which an assembly mounting opening is provided;
• a packing member sealing the assembly mounting opening in a state in which the wiring unit projects out from the opening of the exterior packaging bag and being installed on the assembly mounting opening of the case body;
• and
• a connector connected to the wiring unit inside the case body and to an electrical circuit.