Packaged sensor with multiple sensors elements
AssigneeHoneywell International Inc.
InventorsIan Bentley, Lamar Floyd Ricks
Life of this patent
Estimating the term…
Abstract
The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired.
Claims20
A pressure sensor comprising:
- a substrate including a first side and a second side;
- a first pressure sensing die mounted on the first side of the substrate, wherein the first pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the first pressure sensing die is positioned over a first opening in the substrate, the first opening extending between the first side and the second side of the substrate;
- a second pressure sensing die mounted on the first side of the substrate, wherein the second pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm;
- a first housing member positioned on the first side of the substrate and defining a first cavity around the first pressure sensing die and the second pressure sensing die, wherein the first housing member includes a first pressure opening for exposing the first pressure sensing die and/or the second pressure sensing die to a first pressure;
- and
- a second housing member positioned on the second side of the substrate and defining a second cavity, wherein the second housing member includes a second pressure opening for exposing the first pressure sensing die and/or the second pressure sensing die to a second pressure.
A pressure sensor comprising:
- a substrate;
- a first pressure sensing die mounted on the substrate, wherein the first pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm;
- a second pressure sensing die mounted on the substrate, wherein the second pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm;
- a third pressure sensing die mounted on the substrate, wherein the third pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm;
- a housing positioned on the substrate and defining one or more cavities around the first pressure sensing die, the second pressure sensing die, and the third pressure sensing die;
- wherein the first pressure sensing die, the second pressure sensing die, and the third pressure sensing die are configured to sense different parameters and/or have different resolutions.
A pressure sensor comprising:
- a substrate including a first side and a second side;
- a first pressure sensing die mounted on the first side of the substrate, wherein the first pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the first pressure sensing die is positioned over a first opening in the substrate, the first opening extending between the first side and the second side of the substrate;
- a second pressure sensing die mounted on the first side of the substrate, wherein the second pressure sensing die includes a diaphragm and one or more piezoresistive elements positioned on the diaphragm, wherein the second pressure sensing die is positioned over a second opening in the substrate, the second opening extending between the first side and the second side of the substrate;
- and
- a first housing member positioned on the first side of the substrate and defining a first cavity around the first pressure sensing die and the second pressure sensing die.
Dependencies are inferred from the claim text.