Method of manufacturing a molded sensor subassembly

A sensor assembly for a motor vehicle transmission of a motor vehicle, the sensor assembly being produced according to a method (100) of manufacturing a molded sensor assembly (1) having at least one sensor (3, 4) supported on a first side (2a) of a circuit board (2) of the sensor assembly (1), the method comprising the steps of:

• during a first step (110), introducing a plurality of individual pins (6) into through-bores in the circuit board until either a head or a flange of each of the pins contacts, the first side of the circuit board such that the plurality of pins extend through the circuit board (2) and beyond the first side and an opposite second side of the circuit board in a direction transverse to a plane defined by the circuit board, axially opposite ends of the pins have a respective first and second tool contact surface;
• during a second step (210), disposing the circuit board (2) including the at least one sensor (3, 4) and the plurality of pins (6) in a two-part insert mold tool (10) such that the first and the second tool contact surfaces (7a, 8a) of the plurality of pins (6) engage with the insert mold tool (10), and the plurality of pins (6) define a spacing distance between a surface of the sensor (3, 4) and the insert mold tool (10);
• and
• during a third step (310), filling the insert mold tool (10) with insert molding material (14).

A method of manufacturing an insert molded sensor assembly (1) having at least one sensor arranged on a circuit board of the sensor assembly, the method comprising the steps of:

• securing the at least one sensor to an upper side surface of the circuit board,
• inserting a plurality of individual elongate metal pins into through-bores in the circuit board such that the plurality of metal pins extend normal to the circuit board, each of the metal pins having a first end that comprises either a head or a flange and a second end that is opposite the first end, the head or the flange of the metal pin having an axially facing contact surface that faces the second end of the metal pin, the metal pins being inserted into the through-bores until the contact surface of the head or the flange abuts the upper side surface of the circuit board and prevents further insertion of the metal pins into the through-bores in the circuit board;
• arranging the circuit board in a two-part insert mold tool such that an abutment surface of the heads or the flanges contact a lower tool part of the two-part insert mold tool to support and space the upper side surface of the circuit board from the lower tool part of the two-part insert mold tool and such that the second ends of the metal pins contact an upper tool part of the two-part insert mold tool, the metal pins supporting and spacing the circuit board at a desired distance from the two-part insert mold tool;
• and
• filling the insert mold tool with a molding material (14).