Cleaving apparatus for a band-like glass film and cleaving method for a band-like glass film

A cleaving apparatus for a band-like glass film, which is configured such that the band-like glass film, which is being conveyed in a longitudinal direction thereof, is cleaved along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region resulting from the localized heating, the localized heating and the cooling being performed on a preset cleaving line extending along the conveyance direction of the band-like glass film,

• the cleaving apparatus comprising:
• support means for supporting a back surface side of the band-like glass film;
• air supply means for supplying air during conveying of the band-like glass film to a front surface of the band-like glass film, while the back surface side of the band-like glass film is supported by the support means, to retain the band-like glass film on the support means at a position upstream of a cleaving region in the conveyance direction, the cleaving region being a region in which the band-like glass film is to be cleaved;
• and
• a roll-up device by which at least a part of the band-like glass film that has been cleaved is rolled,
• wherein the band-like glass film is cleaved during the conveying of the band-like glass film along the conveyance direction using the thermal stress after being retained on the support means.