Method of shielding an electronic component from electromagnetic interference (EMI)
AssigneeApple Inc.
InventorsJosh Wurzel, Shawn Robert Gettemy, Ahmad Al-Dahle, Carlin James Vieri, Wei Yao
Life of this patent
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Abstract
An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.
Claims19
A method of shielding an electronic circuit component from an electromagnetic interference, the method comprising:
- applying a layer of electrical insulation to at least part of a surface of the electronic circuit component, the layer of electrical insulation conforming to the surface to which it is applied;
- applying a layer of electromagnetic shielding to at least part of a surface of the layer of electrical insulation, the layer of electromagnetic shielding conforming to the surface to which it is applied, wherein the applying the layer of electrical insulation comprises:
- placing the component in a mold, the mold having an area that fits an end portion of a contact lead of the electronic circuit component so that the end portion of the contact lead is not overlapped by the layer of electrical insulation;
- and
- injecting the layer of electrical insulation into the mold.
A method of shielding an electronic circuit component from electromagnetic interference, the method comprising:
- applying a layer of electrical insulation to at least part of a surface of the electronic circuit component, the layer of electrical insulation conforming to the surface to which it is applied;
- applying a layer of electromagnetic shielding to at least part of a surface of the layer of electrical insulation, the layer of electromagnetic shielding conforming to the surface to which it is applied;
- and
- mounting the electronic circuit component with the layer of electrical insulation and the layer of electromagnetic shielding on a supporting structure, wherein the applying the layer of electrical insulation further comprises:
- placing the electronic circuit component in a mold, the mold having an area that fits an end portion of a contact lead of the electronic circuit component so that the end portion of the contact lead is not overlapped by the layer of electrical insulation;
- and
- injecting the layer of electrical insulation into the mold.
Dependencies are inferred from the claim text.