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US 8,751,994 B2Granted
System and method for testing stacked dies
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorSandeep Kumar Goel
Life of this patent
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Abstract
Systems and methods are disclosed for testing dies in a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.
Claims20
A method for compensating for a delay defect in a die stack, the method comprising the steps of:
- (a) determining a first slack value for a first inter-die path between a first and a second die in the die stack;
- (b) determining a second slack value for a second inter-die path between the first and second dies;
- (c) comparing the first slack value to the second slack value;
- and
- (d) delaying a clock signal to a data storage circuit in the first die by a predetermined amount via a repair circuit in the first die.
2 more elements
A method for testing a die stack, the method comprising the steps of:
- (a) determining a first slack value for a first inter-die path between the first die and a second die in the die stack;
- (b) determining a second slack value for a second inter-die path between the first and second dies;
- and
- (c) inserting a repair circuit in the first die if both the first slack value and the second slack value are greater than a predetermined value.
1 more element
A system comprising:
- a first die comprising:
- a first data storage circuit;
- and
- a repair circuit connected to the first data storage circuit;
- and
- a second die connected to the first die, the second die comprising:
- a second data storage circuit;
- a first inter-die path connecting the first data storage circuit to the second data storage circuit, the first inter-die path having a first path slack value and
- a second inter-die path connecting said first data storage circuit to said second data storage circuit, said second path having a second path slack value,
- wherein the repair circuit conditionally delays a clock signal to the first data storage circuit by a predetermined amount.
7 more elements
Dependencies are inferred from the claim text.