Selective solder stop

A method for bonding a first component to a second component, comprising:

• producing a surface on the first component by forming a first metallic layer on the component, forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer, removing the second metallic layer using a laser in a predefined surface region to expose the first metallic layer, and oxidizing the exposed first metallic layer on the surface, resulting in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region, the surface having a soldering region to be wetted using a solder, the soldering region being adjacent to a predefined surface region having a lesser wettability;
• applying a solder to the soldering region;
• melting the solder;
• and
• bringing the first and second components close together in order to bond the first and second components via the solder.