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US 8,740,040 B2Granted
Solder injection head
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Won Choi, Yon Ho You, Ki Ju Lee
Life of this patent
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Abstract
Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
Claims12
A solder injection head comprising:
- a bump material storing part having a bump material stored therein;
- a discharging part having one side connected to the bump material storing part and discharging the bump material to an outside of the solder injection head;
- a heating part formed at at least one lateral side of the discharging part and being separate from the bump material storing part to heat and melt only the bump material which is to be discharged to the outside excluding the bump material stored in the bump material storing part;
- and
- a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.
2 more elements
A solder injection head comprising:
- a bump material storing part having a bump material stored therein;
- a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside;
- a heating part formed at least one side of the discharging part and heating the bump material passing through the discharging part;
- a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate;
- and
- a flux storing part having a flux stored therein;
- wherein the press-fitting part is formed to be partially inserted into the flux storing part.
4 more elements
Dependencies are inferred from the claim text.