Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

A manufacturing method for circuit members, comprising:

• forming a frame substrate with a die pad portion and a lead portion, by patterning a rolled copper plate or a rolled copper alloy plate;
• laminating metallic skins on a semiconductor chip mounting portion of an upper surface of the die pad portion, and on a portion of the lead portion to be connected to a bonding wire;
• roughing upper surfaces and lateral surfaces of the die pad portion and the lead portion so as to selectively maintain a smooth surface of the semiconductor chip mounting portion, using a micro-etching solution having hydrogen peroxide and sulfuric acid as principal components, with a masking material covering entire bottom surfaces of the die pad portion and the lead portion;
• and
• removing the masking material.

A manufacturing method for a semiconductor device, comprising:

• forming a frame substrate with a die pad portion and a lead portion, by patterning a rolled copper plate or a rolled copper alloy plate;
• roughing upper surfaces and lateral wall surfaces of the die pad portion and the lead portion, using a micro-etching solution having hydrogen peroxide and sulfuric acid as components, with a masking material covering bottom surfaces of the die pad portion and the lead portion and a part of the upper surfaces of the lead portion to be brought into contact with a resin sealing mold so as to maintain smooth surfaces;
• after removal of the masking material, laminating metallic skins on obverse surfaces of the die pad portion and the lead portion;
• mounting a semiconductor chip on the upper surface of the die pad portion;
• connecting the semiconductor chip and the lead portion with a bonding wire;
• and
• molding the semiconductor chip with a sealing resin by contacting a resin sealing mold to the smooth surfaces of the part of the part of the upper surfaces of the lead portion and the smooth surface of the die pad portion and the lead portion.

A manufacturing method for a semiconductor device, comprising:

• forming a frame substrate with a die pad portion and a lead portion, by patterning a rolled copper plate or a rolled copper alloy plate;
• laminating metallic skins on an upper surface of the die pad portion, and on a portion of the lead portion to be connected to a bonding wire;
• surface-roughing the die pad portion and the lead portion, using a micro-etching solution having hydrogen peroxide and sulfuric acid as principal components, with a masking material covering bottom surfaces of the die pad portion and the lead portion having the metallic skins laminated thereon and a part of the upper surfaces of the lead portion to be brought into contact with a resin sealing mold so as to maintain smooth surfaces;
• removing the masking material;
• mounting a semiconductor chip on the upper surface of the die pad portion;
• connecting the semiconductor chip and the lead portion with a bonding wire;
• and
• molding the semiconductor chip with a sealing resin by contacting a resin sealing mold to the smooth surfaces of the part of the upper surfaces of the lead portion and the smooth surfaces of the bottom surfaces of the die pad portion and the lead portion.