Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices

A method, comprising:

• designing a plurality of electronic devices, wherein each of the electronic devices is encapsulated in a cell of a wafer, die or other holder;
• designing a plurality of tethers, wherein each tether includes a first end and a second end;
• selecting an attachment point on each of the plurality of electronic devices, respectively;
• attaching the first end of each of the plurality of tethers to a respective one of the attachment points;
• selecting a plurality of anchor points;
• attaching the second end of each of the plurality of tethers to a respective one of the anchor points;
• determining, for each of the electronic devices, fracture conditions at which the first end of the respective tether detaches from the attachment point of the respective electronic device, wherein the fracture conditions are the same for a group of electronic devices among the plurality of electronic devices;
• agitating the wafer, die or other holder at the fracture conditions for the group of electronic devices so as to selectively and in parallel detach the first ends of the respective tethers from the attachment points of the respective electronic devices of the group;
• and
• separating the electronic devices of the group from the wafer, die or other holder.