Back to results
US 8,710,616 B2Granted
Die seal ring
AssigneeCambridge Silicon Radio Limited
InventorsRainer Herberholz, Howard Godfrey
Life of this patent
Estimating the term…
Abstract
An improved die seal ring is described which includes at least one break. In the region of the break in the die seal ring, the doping is modified so that the impedance of the electrical path across the break through the substrate is increased. Offsets in the break may also be used and the offset may be within a break in a track and/or between breaks in different tracks, where the die seal ring includes more than one track.
Claims12
An integrated circuit die comprising:
- electronic circuitry formed on a substrate;
- and
- a seal ring around a periphery of the die, the seal ring comprising at least one break;
- and
- a block doped region around the break, said block doped region being of the same conduction type as the substrate and modified by introduction of a well and a surface doped area both of which are of an opposite conduction type to the substrate in the break so as to increase the electrical impedance of a path through the substrate across the break.
2 more elements
An integrated circuit die comprising:
- electronic circuitry formed on a substrate;
- and
- a seal ring around a periphery of the die, the seal ring comprising a first and a second track and at least one break pair;
- wherein said break pair comprises an offset break within each track;
- wherein the offset break in the first track is offset from the offset break in the second track;
- and wherein a width of the second track is increased in a region around the offset break within the second track and a width of the first track is decreased within the region around the offset break within the second track.
3 more elements
Dependencies are inferred from the claim text.