Latch-up free ESD protection
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsDa-Wei Lai, Handoko Linewih
Life of this patent
Estimating the term…
Abstract
An ESD module having a first portion (FP) and a second portion (SP) in a substrate is presented. The FP includes a FP well of a second polarity type and first and second FP contact regions. The first FP contact region is of a first polarity type and the second FP contact region is of a second polarity type. The SP includes a SP well of a first polarity type and first and second SP contact regions. The first SP contact region is of a first polarity type and the second SP contact region is of a second polarity type. An intermediate portion (IP) is disposed in the substrate between the FP and SP in the substrate. The IP includes a well of the second polarity type. The IP increases trigger current and holding voltage of the module to prevent latch up during normal device operation.
Claims20
An ESD module comprising:
- a first portion (FP) in a substrate, the FP includes a FP well of a second polarity type and first and second FP contact regions, the first FP contact region is a first polarity type FP contact region and the second FP contact region is a second polarity type FP contact region;
- a second portion (SP) in the substrate, the SP includes a SP well of a first polarity type and first and second SP contact regions, the first SP contact region is a first polarity type SP contact region and the second SP contact region is a second polarity type SP contact region;
- an intermediate portion (IP) disposed in the substrate between the FP and SP in the substrate, the IP includes an IP well of the second polarity type;
- and
- wherein the IP increases trigger current and holding voltage of the ESD module to prevent latch up during normal device operation.
An ESD module comprising:
- a first portion (FP) in a substrate, the FP includes a FP well of a second polarity type and first, second and third FP contact regions, the first and third FP contact regions are first polarity type FP contact regions, the second FP contact region is a second polarity type FP contact region;
- a second portion (SP) in the substrate, the SP includes a SP well of a first polarity type and first and second SP contact regions, the first SP contact region is a first polarity type SP contact region and the second SP contact region is a second polarity type SP contact region;
- an intermediate portion (IP) disposed in the substrate between the FP and SP in the substrate, the IP includes an IP well of the second polarity type;
- and
- wherein the IP increases trigger current and holding voltage of the ESD module to prevent latch up during normal device operation.
A method of forming a device comprising:
- providing a substrate prepared with an ESD module, wherein the ESD module comprises
- a first portion (FP) in a substrate, the FP includes a FP well of a second polarity type and first and second FP contact regions, the first FP contact region is a first polarity type FP contact region and the second FP contact region is a second polarity type FP contact region,
- a second portion (SP) in the substrate, the SP includes a SP well of a first polarity type and first and second SP contact regions, the first SP contact region is a first polarity type SP contact region and the second SP contact region is a second polarity type SP contact region,
- an intermediate portion (IP) disposed in the substrate between the FP and SP in the substrate, the IP includes an IP well of the second polarity type, and
- wherein the IP increases trigger current and holding voltage of the ESD module to prevent latch up during normal device operation.
Dependencies are inferred from the claim text.