Pattern transfer apparatus and method for fabricating semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorYuji Kobayashi
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Abstract
A pattern transfer apparatus according to one embodiment includes a transfer region selecting part that performs operation in which when performing pattern transfer from a template provided with N transfer regions (N is an integer of 2 or larger) to a transferring substrate a plurality of times, 1 to N−1 transfer regions, which are to be used to perform the transfer to regions of the transferring substrate corresponding to part of the N transfer regions, are selected such that the number of the transfer to be performed using each of the N transfer regions is evened out.
Claims20
A pattern transfer apparatus comprising a transfer region selecting part that performs operation in which when performing pattern transfer from a template provided with N transfer regions (N is an integer of 2 or larger) to a transferring substrate a plurality of times, 1 to N−1 transfer regions, which are to be used to perform the transfer to regions of the transferring substrate corresponding to part of the N transfer regions, are selected such that the number of the transfer to be performed using each of the N transfer regions is evened out.
A pattern transfer apparatus comprising:
- a stage that holds a wafer used as a transferring substrate;
- driving parts that move the stage back and forth, and right and left;
- a nozzle that delivers an imprinting material onto the wafer;
- an ultraviolet irradiating unit that irradiates the imprinting material on the wafer with ultraviolet light via a template provided with N transfer regions (N is an integer of 2 or larger);
- and
- a driving control unit that controls the driving parts so as to even out the number of pattern transfer to be performed using each of the N transfer regions.
A method for fabricating a semiconductor device comprising:
- forming imprinting patterns by repeating process wherein when performing pattern transfer to regions of a transferring substrate corresponding to part of N transfer regions (N is an integer of 2 or larger) provided at a template, 1 to N−1 transfer regions are selected such that the number of the transfer to be performed using each of the N transfer regions is evened out, and the pattern transfer is performed by applying an imprinting material onto an underlying layer of the transferring substrate and pressing the template on the imprinting material;
- and
- processing the underlying layer via the imprinting patterns formed on the underlying layer.
Dependencies are inferred from the claim text.