Methods and apparatus for performing multiple photoresist layer development and etching processes
AssigneeApplied Materials, Inc.
InventorsBanqiu Wu, Ajay Kumar, Kartik Ramaswamy, Omkaram Nalamasu
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AssigneeApplied Materials, Inc.
InventorsBanqiu Wu, Ajay Kumar, Kartik Ramaswamy, Omkaram Nalamasu
Estimating the term…
The present invention provides methods and an apparatus controlling and minimizing process defects in a development process, and modifying line width roughness (LWR) of a photoresist layer after the development process, and maintaining good profile control during subsequent etching processes. In one embodiment, a method for forming features on a substrate includes developing and removing exposed areas in the photosensitive layer disposed on the substrate in the electron processing chamber by predominantly using electrons, removing contaminants from the substrate by predominantly using electrons, and etching the non-photosensitive polymer layer exposed by the developed photosensitive layer in the electron processing chamber by predominantly using electrons.
A method for forming features on a substrate comprising:
A method for developing a photosensitive layer disposed on a substrate comprising:
A method for forming features on a substrate comprising:
Dependencies are inferred from the claim text.