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US 8,709,278 B2Granted
Polishing composition
AssigneeNitta Haas Incorporated
InventorsTakayuki Matsushita, Noriaki Sugita
Life of this patent
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Abstract
A polishing composition that allows polishing speed to be increased and surface roughness to be reduced is provided. The polishing composition according to the present invention includes a compound including at least an oxyethylene group or an oxypropylene group in a block polyether represented by the following general formula (1), a basic compound, and abrasives: >N—R—N< (1) where R represents an alkylene group expressed as CnH2n and “n” is an integer not less than 1.
Claims6
A polishing composition, comprising:
- a compound including an alkylamine structure having two nitrogen atoms represented by the following general formula (1) and at least one block polyether bonded to one of the two nitrogen atoms in the alkylamine structure, the block polyether including an oxyethylene group and an oxypropylene group;
- a basic compound;
- and
- abrasives,
- >N—R—N< (1)
- where R represents an alkylene group expressed by CnH2nand “n” is an integer not less than 1,
- wherein said basic compound is at least one selected from a quaternary ammonium and a salt thereof, a primary amine, a secondary amine, and a tertiary amine and
- a content of the compound is not less than 0.00001% and less than 10% by weight of the total amount of the polishing composition.
5 more elements
Dependencies are inferred from the claim text.