Multi-fluid, two-phase immersion-cooling of electronic component(s)

A liquid-cooled electronic system comprising:

• an electronics rack comprising at least one electronic component to be cooled;
• and
• a cooling apparatus immersion-cooling the at least one electronic component, the cooling apparatus comprising:
• a housing at least partially surrounding and forming a fluid-tight compartment about the at least one electronic component;
• a boiling fluid mixture comprising a first dielectric fluid and a second dielectric fluid disposed within the fluid-tight compartment, the at least one electronic component being immersed within the boiling fluid mixture;
• a condensing fluid disposed within the fluid-tight compartment, the condensing fluid and the boiling fluid mixture being immiscible, and the condensing fluid comprising a lower specific gravity than that of the boiling fluid mixture, and a higher thermal conductivity than that of the boiling fluid mixture, and wherein the condensing fluid facilitates condensing of vaporized boiling fluid mixture within the fluid-tight compartment;
• and
• a cooling structure disposed within the fluid-tight compartment, the cooling structure comprising a condensing region and a sub-cooling region, the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture, wherein the cooling structure facilitates heat removal from the fluid-tight compartment.

A method of facilitating cooling of at least one electronic component, the method comprising:

• providing a housing at least partially surrounding and forming a fluid-tight compartment about the at least one electronic component to be cooled;
• providing a boiling fluid mixture comprising a first dielectric fluid and a second dielectric fluid that comprises a desired boiling temperature, the first dielectric fluid and the second dielectric fluid being miscible;
• immersing the at least one electronic component within the boiling fluid mixture;
• providing a condensing fluid disposed within the fluid-tight compartment, the condensing fluid and the boiling fluid mixture being immiscible, and the condensing fluid comprising a lower specific gravity than that of the boiling fluid mixture, and a higher thermal conductivity than that of the boiling fluid mixture, and wherein the condensing fluid facilitates condensing of vaporized boiling fluid mixture within the fluid-tight compartment;
• and
• providing a cooling structure disposed within the fluid-tight compartment, the cooling structure comprising a condensing region and a sub-cooling region, the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture, wherein the cooling structure facilitates heat removal from the fluid-tight compartment.